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Here you can find all details about the upcoming international workshops, seminars and conferences, organized by Association CIEES.

Upcoming:

1. 7th International Scientific Conference of Communications, Information, Electronic and Energy Systems – CIEES 2026

Place: Hisarya, Bulgaria (HYBRID)
Date:
25 – 27 November 2026
IEEE technically co-sponsored conference: https://conferences.ieee.org/conferences_events/conferences/conferencedetails/71228 

Topics:

  • Telecommunication Systems;
  • Information Technologies and Artificial Intelligence;
  • Power System & Smart Cities;
  • Energy and Renewable Sources;
  • Automotive and Industrial Engineering;
  • Smart Telecommunications, Industry and Services;
  • Electronics, Power Electronics and EMC;
  • Energy Efficiency and Applied Thermodynamics;
  • Mechatronics and Industrial Automation;
  • Biomedical Engineering
  • Project Dissemination.

Official website: https://ciees.eu/

2. 6th International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2027)

Place: Alexandroupolis, Greece (HYBRID)
Date:
23 – 25 June 2027
Publishers: TBA. 

Topics:

  • Telecommunication Systems;
  • Applied and Engineering Physics;
  • Renewable Energy and Green Technologies;
  • Distributed Ledger Technologies and Blockchain;
  • Electronics, Power Electronics and EMC;
  • Information Technologies and Artificial Intelligence;
  • Energy Efficiency and Applied Thermodynamics;
  • Optical and Electromagnetic Communication;
  • Mechatronics and Industrial Automation;
  • Automotive Engineering and E-vehicles;
  • Biomedical Engineering;
  • Project Dissemination.

Official website: https://eepes.eu/

 

3. Forthcoming issue of The Journal of CIEES (It will be published on 20 December 2026).

Official website: https://journal.ciees.eu.

 

4. Special Issue "Application of Artificial Intelligence in the New Era of Communication Networks, 2nd Edition" in an open access MDPI journal “Electronics” (ISSN 2079-9292;  CiteScore - Q2, IF 2.6):

Official website: https://www.mdpi.com/journal/electronics/special_issues/VR55ENQC0K